Tag Archive eSI

RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2

As you may have read in the first part of this series, Soitec (the industry's leading supplier of SOI wafers) says its 200mm RF-SOI wafers have b

RF-SOI Innovator JP Raskin (his team’s work is in your smartphone) Awarded Blondel Medal

Professor Jean-Pierre Raskin (right) receiving the Blondel Medal for his industry-changing work on RF-SOI. Jury president Professor Pere Rocal I

RF-SOI: Already in Every Smartphone, New Opps Abound in IoT (SF Workshop Part 3 of 3: IBM, ST, GF and more)

RF-SOI is already found in virtually every new smartphone out there, so the RF-SOI session of the recent FD-SOI/RF-SOI Workshop in San Francisco

How SOI wafers for RF predict LTE-A/5G device performance

Soitec has developed an innovative metrology and metric for ensuring that devices built on our latest SOI wafers for RF will meet the draconian d

LTE-A/5G: Bring it on. Next-gen Soitec eSI90 wafers predict & improve RF performance.

The folks at SOI wafer maker Soitec have announced an amazing update to their RF wafer line-up, with what they’re calling their eSI90 substrate

Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices

Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the pr

Soitec White Paper Explains Value of New RF-SOI Wafers for 4G/LTE Applications

Soitec has issued a highly-informative new white paper on its enhanced signal integrity – aka eSI™ – wafers for 4G and LTE/A applications (

Soitec’s New eSI SOI Wafers For 4G/LTE (Now in High Volume Production) Used at Most Leading RF Foundries

Soitec has reached high-volume manufacturing of our new Enhanced Signal Integrity™ (eSI) substrates, enabling cost-effective and high-performan

SOITEC and UCL boost the RF performance of SOI substrates

Soitec and a team from UCL have been working together to identify the technological opportunities to further improve the high-frequency performan