IEEE S3S Conference
10-13 October 2016
Hyatt Regency San Francisco Airport
IEEE SOI–3D–Subthreshold Microelectronics Technology Unified Conference
Theme: Energy Efficient Technology for the Internet of Things
Late News submissions open and Advance Program available
The IEEE S3S Conference brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, and Subthreshold Microelectronics. The numerous degrees of freedom they allow enable the ultra-low power operation and adjustable performance level mandatory for energy-starved systems, perfectly suiting the needs of the numerous categories of connected devices commonly referred to as the Internet of Things. This natural synergy was made obvious during the talks we listened to during past editions of the conference. For this reason, we adopted “Energy Efficient Technology for the Internet of Things” as the theme of the 2016 IEEE S3S.
This theme will be present throughout the conference. It will start on October 10th with a full day tutorial addressing two important IoT-related topics: Energy Efficient Computing and Communications, and will peak during the Plenary Hot Topics session, focused on the Internet of Things, on Thursday October 13th.
We have an outstanding technical program, including a very strong list of invited speakers, all of them leading authorities from illustrious organizations.
Our Keynote speakers are decision-makers from major industries:
Several sessions will also be of particular interest to designers and technologists who want to learn about new knobs to implement in their circuits: Two tutorials, related to 3D technology and SOI design respectively and the technical sessions on SOI and Low Voltage Circuit Design.
Applications will be illustrated in our session dedicated to SOI circuit implementations.
You can look at our Advance Program to get details about the technical content of the conference, as well as the conference venue and registration.
And you still have time to actively participate by submitting a late news paper before August 31st.
The conference has a long tradition of allying technical and social activities.
This will be the case again this year with several dinners & receptions that will give us plenty of opportunities to discuss with our colleagues.
With its broad scope of technology-related applications and social-oriented environment, the S3S is an excellent venue to meet new people with different but related research interests. It is an efficient way to shed new light on your own focus area, and to sprout new ideas and collaboration themes. It is also a place where industry and academia can exchange about the application of on-going research and tomorrow’s company needs.
Deadline for Late News submissions is
August 31st, 2016
For further information, please visit our website at s3sconference.org or contact the conference manager:
Joyce Lloyd • 6930 De Celis Pl., #36
Van Nuys, CA 91406
T 818.795.3768 • F 818.855.8392 • E email@example.com
Don’t forget to get your paper submitted to the top conference with a major focus on the SOI ecosystem: the IEEE S3S (SOI/3D/SubVt). The Call For Papers (CFP) deadline is April 15, 2016. As we noted for you in ASN back in December, the theme of the conference, which will take place October 10th – 13th in San Francisco, is “Energy Efficient Technology for the Internet of Things”.
As of this writing, the following keynote speakers have been confirmed:
Invited speakers include:
As always, there will be a Best Paper Award and a Best Student Paper Award. But students take note: the recipient of the Best Student Paper will also receive $1000 from Qualcomm.
Papers related to technology, devices, circuits and applications (more details here) in the following areas are requested :
For current information on the conference visit the S3S website at: http://s3sconference.org/
LinkedIn users will also want to join the conference group at IEEE SOI-3D-Subthreshold Microelectronics Technology (S3S) Unified Conference.
Skyworks is augmenting their RF front-end portfolio with a new family of SOI-based antenna switch modules (ASMs) for dual and triple-mode smart phones, tablets and datacards, which require design flexibility, high performance and cost-effective architectures.
More than Moore market and technology trends, Thibault Buisson, Yole Developpement
Wafer-Level Heterogeneous Integration Technology and Its Application, Prof. Shuji Tanaka, Tohoku University, Sendai, Japan
Prominent Materials of HIST to enable the IoT, Prof. G.P. Li, Calit2, University of California-Irvine, USA
Biosensors and Healthcare, Dr. Qinghuang Lin, IBM T.J. Watson Research Center, USA
Vitual Fabrication for advanced Semiconductor technology, David M. Fried, Coventor
Overview of Power SOI Application, Dr. Bernard Aspar, Soitec
Power SOI Application, Dr. James Young, Skyworks
RF SOI: A Deeper Insight for a Faster Time-to-Market, Dr. Mostafa Emam, Incize
Photonics, RF- & FD-SOI for IoT Applications, Kirk Ouellette, STMicroelectronics
SOI for RF Applications and Beyond, Alfred Zhu,, Sitri
GlobalFoundries has announced availability of its 45nm RF-SOI technology (read the press release here). Dubbed 45RFSOI, the company says it’s the first 300mm RF solution for next-gen mmWave beamforming applications in future 5G base stations and smart phones.
The technology supports mmWave spectrum operation from 24GHz to 100GHz band, 5x more than 4G operating frequencies.
Skyworks’ CTO Peter Gammel says that the 45RFSOI process, “…is enabling Skyworks to create RF solutions that will revolutionize emerging 5G markets and further advance the deployment of highly integrated RF front-ends for evolving mmWave applications.”
The news was quickly picked up by publications across the industry, with EETimes noting that RFSOI has been a big GF success story.
Production will be at the company’s East Fishkill fab. The PDKs are available now.
The 45RFSOI news follows hard on the heels of GF’s announcement a few days prior that the company is teaming up to build a fab offering 22nm FD-SOI in western China, that it’s expanding its Dresden FD-SOI capability by 40 percent, and that it’s adding new RF-SOI capabilities to its fab in Singapore.
GlobalFoundries is a member of the SOI Industry Consortium.