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NXP, Qualcomm, Skyworks to Keynote IoT Theme in Upcoming IEEE SOI-3D-SubVt (S3S) Conference (San Francisco, Oct.’16) – Late News Submissions Open, Advance Program Available

IEEE S3S Conference 10-13 October 2016 Hyatt Regency San Francisco Airport IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Confer

Reminder re: top SOI Conference – IEEE S3S ’16 (SOI/3D/SubVt) CFP deadline April 15th. Keynotes: NXP, Skyworks, Qualcomm

Don't forget to get your paper submitted to the top conference with a major focus on the SOI ecosystem: the IEEE S3S (SOI/3D/SubVt). The Call For

ASN Exclusive Interview: Skyworks on SOI for RF

Skyworks has a growing portfolio of chips on SOI. Kevin Walsh, the company's Marketing Director of Analog Solutions, tells ASN why. Kevin W

Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers

Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and

Skyworks credits part of its Q1 FY12 success to having commenced volume production of advanced SOI-based Antenna Switch Modules (ASMs) for Huawei

Skyworks credits part of its Q1 FY12 success to having commenced volume production of advanced SOI-based Antenna Switch Modules (ASMs) for Huawei

Skyworks has launched two new SOI CMOS single-pole, triple-throw (SP3T) switches

Skyworks has launched two new SOI CMOS single-pole, triple-throw (SP3T) switches, the SKY13345-368LF and the SKY13385-460LF.  With their high li

Skyworks is augmenting their RF front-end portfolio

Skyworks is augmenting their RF front-end portfolio with a new family of SOI-based antenna switch modules (ASMs) for dual and triple-mode smart p

Skyworks’ new antenna

Skyworks’ new antenna switch modules for 2/3/4G handset and data card platforms use both GaAs and SOI technologies.

17 March 2015: Shanghai Workshop MEMS & More than Moore

Presentations More than Moore market and technology trends, Thibault Buisson, Yole Developpement Wafer-Level Heterogeneous Integration Techno

GF: 45nm RF-SOI PDKs for 5G

GlobalFoundries has announced availability of its 45nm RF-SOI technology (read the press release here). Dubbed 45RFSOI, the company says it’s t